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半导体学报 1988
Rapid Thermal Annealing of Al-Si Contacts
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Abstract:
A simple and direct method,Al-Si ohmic contact achieved by utilizing rapid thermalannealing for 30 sec of conventional furnace instead of conventional sintering,is reported.AES, SEM, specific contact resistance and PN junction reverse currem investigations showthat Al-Si interdiffusion phenomenon which causes the failure for shallow junction device canbe restricted effectively,therefore ohmic contact with good junction property can be achieved.