Solder Joint Fatigue Reliability of vf-BGA Package
vf-BGA封装焊球热疲劳可靠性的研究

Software ANSYS with finite element analysis(FEA) method is employed to simulate thermal fatigue behavior of solder joints.The compose and microstructure of intermetallic compound after temperature cycling test are also observed by scanning electron microscope(SEM).The results of experiment and simulation indicate that the shear and fatigue strength of solder joints are affected by the stress strain accumulation,intermetallic compound (IMC) thickness,and microstructure of IMC.The predicted crack initial lifetime with Darveaux energy model is verified by the experimental data.