%0 Journal Article
%T Solder Joint Fatigue Reliability of vf-BGA Package<br>vf-BGA封装焊球热疲劳可靠性的研究
%A He Ping
%A Peng Yaowei
%A Wu Jianbo
%A Meng Xuanhua
%A He Guowei
%A <br>和平
%A 彭瑶玮
%A 乌健波
%A 孟宣华
%A 何国伟
%J 半导体学报
%D 2004
%I 
%X Software ANSYS with finite element analysis(FEA) method is employed to simulate thermal fatigue behavior of solder joints.The compose and microstructure of intermetallic compound after temperature cycling test are also observed by scanning electron microscope(SEM).The results of experiment and simulation indicate that the shear and fatigue strength of solder joints are affected by the stress strain accumulation,intermetallic compound (IMC) thickness,and microstructure of IMC.The predicted crack initial lifetime with Darveaux energy model is verified by the experimental data.
%K temperature cycling test
%K 3D
%K finite element analysis
%K solder ball shear strength
%K intermetallic compound
%K fatigue lifetime<br>温度循环
%K 三维有限元模拟
%K 焊球剪切强度
%K 金属间化合物
%K 疲劳寿命
%U http://www.alljournals.cn/get_abstract_url.aspx?pcid=5B3AB970F71A803DEACDC0559115BFCF0A068CD97DD29835&cid=1319827C0C74AAE8D654BEA21B7F54D3&jid=025C8057C4D37C4BA0041DC7DE7C758F&aid=02777E471EDF9C24&yid=D0E58B75BFD8E51C&vid=C5154311167311FE&iid=DF92D298D3FF1E6E&sid=3893EBCAC6700388&eid=2D207DE75533FA7E&journal_id=1674-4926&journal_name=半导体学报&referenced_num=4&reference_num=10