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OALib Journal期刊
ISSN: 2333-9721
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Development of Dielectric Materials and Processing for Mulitilayer Chip Inductors
多层片式电感器介质材料及其工艺的发展现状

Keywords: multilayer chip inductors,low-temperature sintering dielectric materials,multilayer chip processings
多层片式电感
,低烧介质材料,多层片式工艺,生产工艺

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Abstract:

Recently overseas and domestic general situation and developing tendence about dielec- tric materials and the processings for MLCIs were reviewed. Different low-temperature sintering materials should be selected for MLCIs in different frequency ranges. The research on the low dielectric constants materials for high frequency MLCIs particularly was introduced. While the specially and typically producing processings of MLCIs were summarized.

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