%0 Journal Article
%T Development of Dielectric Materials and Processing for Mulitilayer Chip Inductors<br>多层片式电感器介质材料及其工艺的发展现状
%A LUO Ling-Hong
%A ZHOU He-Ping
%A HUANG He-Ji
%A WANG Shao-Hong
%A <br>罗凌虹
%A 周和平
%A 黄河激
%A 王少洪
%J 无机材料学报
%D 2001
%I Science Press
%X Recently overseas and domestic general situation and developing tendence about dielec- tric materials and the processings for MLCIs were reviewed. Different low-temperature sintering materials should be selected for MLCIs in different frequency ranges. The research on the low dielectric constants materials for high frequency MLCIs particularly was introduced. While the specially and typically producing processings of MLCIs were summarized.
%K multilayer chip inductors
%K low-temperature sintering dielectric materials
%K multilayer chip processings<br>多层片式电感
%K 低烧介质材料
%K 多层片式工艺
%K 生产工艺
%U http://www.alljournals.cn/get_abstract_url.aspx?pcid=5B3AB970F71A803DEACDC0559115BFCF0A068CD97DD29835&cid=84529CA2B2E519AC&jid=ABC0063016AF57E1C73EF43C8D2212BD&aid=3B518CDEBA4C7F75&yid=14E7EF987E4155E6&vid=7801E6FC5AE9020C&iid=B31275AF3241DB2D&sid=31CCC5D591A72A74&eid=FC27EB98080C89E6&journal_id=1000-324X&journal_name=无机材料学报&referenced_num=8&reference_num=53