On the Non-Destructive Testing for Defects Caused by Electronic Package Based on Infrared Thermal Imaging
基于红外热成像技术的电子封装缺陷无损检测方法

In the packaging manufacture and service process of electronic devices, process and thermal loading facilitate the internal delamination, which seriously degrades the product excellence and reliability. It is very important to timely detect these internal defects. Infrared thermal imaging detection technique has gradually become an effective means of no-destructive testing due to non-contact, real-time recording, rapid test and quantitative analysis etc. The detection of defect located at the interface between molding compound and copper substrate was carried out by active double-sided infrared measurement. The relationship among the sample surface temperature distribution and the defect size and the depth was obtained. By comparing the experimental data with the calculated results from defect depth theory, the quantitative identification of specimen internal defect characteristics is realized.