%0 Journal Article
%T On the Non-Destructive Testing for Defects Caused by Electronic Package Based on Infrared Thermal Imaging<br>基于红外热成像技术的电子封装缺陷无损检测方法
%A QIN Fei
%A LIU Cheng-yan
%A BAN Zhao-wei
%A <br>秦飞
%A 刘程艳
%A 班兆伟
%J 实验力学
%D 2013
%I 
%X In the packaging manufacture and service process of electronic devices, process and thermal loading facilitate the internal delamination, which seriously degrades the product excellence and reliability. It is very important to timely detect these internal defects. Infrared thermal imaging detection technique has gradually become an effective means of no-destructive testing due to non-contact, real-time recording, rapid test and quantitative analysis etc. The detection of defect located at the interface between molding compound and copper substrate was carried out by active double-sided infrared measurement. The relationship among the sample surface temperature distribution and the defect size and the depth was obtained. By comparing the experimental data with the calculated results from defect depth theory, the quantitative identification of specimen internal defect characteristics is realized.
%K electronic package
%K defect
%K infrared thermal imaging
%K non-destructive testing<br>电子封装
%K 缺陷
%K 红外热成像
%K 无损检测
%U http://www.alljournals.cn/get_abstract_url.aspx?pcid=6E709DC38FA1D09A4B578DD0906875B5B44D4D294832BB8E&cid=5D344E2AD54D14F8&jid=49067A0A0D864088C06A84AACB51A5B2&aid=816BCC9BC16994C77827BF9ED3530B73&yid=FF7AA908D58E97FA&vid=D3E34374A0D77D7F&iid=0B39A22176CE99FB&sid=527AEE9F3446633A&eid=D5C73DEF4CF8FAF3&journal_id=1001-4888&journal_name=实验力学&referenced_num=0&reference_num=0