Experimental and Numerical Analysis of Thermal Deformation of Electronic Packages,QFP and MCM

0Introduction Anelectronicpackageisgenerallyconstructedwithanactivesiliconchip,mountisland,gold wires,leadframesandsoldersasshowninFig.1(a).Toprotectfromtheenvironment,thesilicon chipisusuallyencapsulatedinresin.SincethesematerialshavedifferentCTE(coefficientofthermal expansion),stressandstrainaregeneratedbyinternalheatinginserviceoperationorthermalloading fromtheenvironment1].Insomecases,thismaycausefailureofthewireandcrackinganddebonding insidethepackage.Thereliabilityofelectronicpackages…