%0 Journal Article
%T Experimental and Numerical Analysis of Thermal Deformation of Electronic Packages,QFP and MCM
%A Yasuyuki Morit
%A Kazuo Arakawa
%A Mitsugu Todo
%A <br>Yasuyuki Morit
%A Kazuo Arakaw
%A Mitsugu Todo
%J 实验力学
%D 2006
%I 
%X 0Introduction Anelectronicpackageisgenerallyconstructedwithanactivesiliconchip,mountisland,gold wires,leadframesandsoldersasshowninFig.1(a).Toprotectfromtheenvironment,thesilicon chipisusuallyencapsulatedinresin.SincethesematerialshavedifferentCTE(coefficientofthermal expansion),stressandstrainaregeneratedbyinternalheatinginserviceoperationorthermalloading fromtheenvironment1].Insomecases,thismaycausefailureofthewireandcrackinganddebonding insidethepackage.Thereliabilityofelectronicpackages…
%K 数字分析
%K 热形变
%K 电子仪器组件
%K QFP
%K MCM
%U http://www.alljournals.cn/get_abstract_url.aspx?pcid=6E709DC38FA1D09A4B578DD0906875B5B44D4D294832BB8E&cid=5D344E2AD54D14F8&jid=49067A0A0D864088C06A84AACB51A5B2&aid=58910A0F89374DBB&yid=37904DC365DD7266&vid=659D3B06EBF534A7&iid=CA4FD0336C81A37A&sid=708DD6B15D2464E8&eid=2A8D03AD8076A2E3&journal_id=1001-4888&journal_name=实验力学&referenced_num=1&reference_num=7