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A novel double-trench LVTSCR used in the ESD protection of a RFIC
一种新的用于RFIC ESD保护的双槽LVTSCR

Keywords: UDSM,LVTSCR,RFIC,ESD design window
ESD保护
,射频集成电路,沟槽,超深亚微米,RFIC,寄生参数,影响因素,配置模式

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Abstract:

A low-voltage triggering silicon-controlled rectifier (LVTSCR), for its high efficiency and low parasitic parameters, has many advantages in ESD protection, especially in ultra-deep sub-micron (UDSM) IC and high frequency applications. In this paper, the impact factors of the snapback characteristics of a LVTSCR and the configuring modes are analyzed and evaluated in detail. These parameters include anode series resistance, gate voltage, structure and size of devices. In addition, a double-trench LVTSCR is presented that can increase the hold-on voltage effectively and offers easy adjustment. Also, its snapback characteristics can obey the ESD design window rule very well. The strategy of ESD protection in a RFIC using a LVTSCR is discussed at the end of the paper.

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