The United States remains a dominant exporter of integrated circuits (ICs), a cornerstone of global technological advancement and industrial competitiveness. However, the evolving geopolitical and policy landscape has reshaped export flows, partner concentration, and the structure of value creation within the global semiconductor ecosystem. This study examines the dynamics of U.S. IC exports from 2015 to 2024, evaluating shifts in competitiveness and market diversification using a framework built on Revealed Comparative Advantage (RCA) and Herfindahl-Hirschman Index (HHI). Using annual UN Comtrade data for HS codes 8542 (ICs), the analysis identifies a post-2022 realignment driven by trade tensions and industrial policy interventions such as the CHIPS and Science Act. Results reveal a decline in exports to East Asia—especially the Chinese mainland and Hong Kong SAR—accompanied by increased flows to Mexico, Singapore, and the European Union. These findings suggest a regionalized restructuring of U.S. semiconductor exports toward allied economies. From a business management perspective, this shift reflects a growing emphasis on resilience, policy alignment, and strategic adaptation within global supply networks.
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