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Workload-Dependent Thermal Locality in AI GPU Nodes: Evidence from H100 and B200 Intra-Node Thermal Divergence

DOI: 10.4236/ica.2026.173004, PP. 77-107

Keywords: AI Infrastructure, H100, B200, Thermal Locality, Node Thermal Spread, Workload Measurement, Data-Center Cooling, Thermal Management, GPU Heat Management

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Abstract:

The increasing power density of AI infrastructure places critical importance on the thermal behavior of data-center GPUs. Measurements of these GPUs’ temperatures, however, rely on aggregate metrics such as hardware power ratings, data-center efficiency metrics, and node temperatures, none of which provide information about the temperature distribution across the GPUs within that node. As a result, it is important to determine whether thermal divergence among GPU nodes varies with the hardware model alone or with the workloads assigned to those nodes. An analysis of 32 public sessions, each with eight GPUs assigned to either image-generation or language-model and text-generation workloads, shows that the mean temperature spread between the hottest and coolest GPU within each session is 13.58?C, a value that far exceeds the 1?C resolution of each GPU’s temperature measurements. Furthermore, analysis of the interaction between workload and hardware reveals that H100 GPUs exhibit a greater temperature spread during image-generation workloads than during language-model and text-generation workloads. In comparison, B200 GPUs exhibit a greater temperature spread during language-model and text-generation workloads than during image-generation workloads (interaction effect: 16.77?C, F(1, 28) = 67.88, p < 0.001). These results are statistically significant even after adjusting for heteroskedasticity, permutation tests, bootstrap resampling, leave-one-session-out model refitting, and total GPU power within each session. Furthermore, because each set of GPU workload data was collected on different dates, these results indicate only a relationship between workload and GPU thermal divergence, not between the workload itself and that divergence. Thus, thermal assumptions based solely on the hardware model or on the average temperature of GPUs within a node provide incomplete descriptions of the thermal behavior of those nodes. As such, decisions regarding data-center cooling, scheduling workloads across nodes, hardware procurement, and managing the thermal behavior of those GPUs should account for thermal divergence based on each GPU’s workload. Furthermore, while this study was unable to provide evidence of any effect of these workloads on the throttling or useful computation of those GPUs, such conclusions would require validation of these assumptions.

References

[1]  International Energy Agency (2025) Energy and AI (World Energy Outlook Special Report). IEA.
https://www.iea.org/reports/energy-and-ai
[2]  Lawrence Berkeley National Laboratory (2024) 2024 United States Data Center Energy Usage Report.
https://eta-publications.lbl.gov/publications/2024-lbnl-data-center-energy-usage-report
[3]  Electric Power Research Institute (2026) Powering Intelligence 2026: Updated Scenarios of U.S. Data Center Electricity Use and Power Strategies (Report No. 3002034696). EPRI.
https://www.epri.com/research/products/000000003002034696
[4]  ASHRAE, NEMA and Pacific Northwest National Laboratory (2026) AI Data Center Energy Performance Framework. ASHRAE, NEMA and PNNL.
https://www.ashrae.org/technical-resources/ai-data-center-framework
[5]  The Green Grid (2012) PUE: A Comprehensive Examination of the Metric (White Paper No. 49; V. Avelar, D. Azevedo, & A. French, Eds.). The Green Grid.
https://archive.thegreengrid.org/en/resources/library-and-tools/237-WP
[6]  Horner, N. and Azevedo, I. (2016) Power Usage Effectiveness in Data Centers: Overloaded and Underachieving. The Electricity Journal, 29, 61-69.
https://doi.org/10.1016/j.tej.2016.04.011
[7]  Fan, X., Weber, W. and Barroso, L.A. (2007) Power Provisioning for a Warehouse-Sized Computer. Proceedings of the 34th Annual International Symposium on Computer Architecture, San Diego, 9-13 June 2007, 13-23.
https://doi.org/10.1145/1250662.1250665
[8]  Skadron, K., Stan, M.R., Huang, W., Velusamy, S., Sankaranarayanan, K. and Tarjan, D. (2003) Temperature-Aware Microarchitecture. Proceedings of the 30th Annual International Symposium on Computer Architecture—ISCA’03, San Diego, 9-11 June 2003, 2-13.
https://doi.org/10.1145/859618.859620
[9]  Huang, W., Ghosh, S., Velusamy, S., Sankaranarayanan, K., Skadron, K. and Stan, M.R. (2006) Hotspot: A Compact Thermal Modeling Methodology for Early-Stage VLSI Design. IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 14, 501-513.
https://doi.org/10.1109/tvlsi.2006.876103
[10]  Hamann, H.F., Weger, A., Lacey, J.A., Hu, Z., Bose, P., Cohen, E., et al. (2007) Hotspot-Limited Microprocessors: Direct Temperature and Power Distribution Measurements. IEEE Journal of Solid-State Circuits, 42, 56-65.
https://doi.org/10.1109/jssc.2006.885064
[11]  Heterogeneous Integration Roadmap (2023) Chapter 20: Thermal. IEEE Electronics Packaging Society.
https://eps.ieee.org/wp-content/uploads/2025/11/ch20_thermalfinal.pdf
[12]  Patel, P., Choukse, E., Zhang, C., Goiri, í., Warrier, B., Mahalingam, N., et al. (2024) Characterizing Power Management Opportunities for LLMs in the Cloud. Proceedings of the 29th ACM International Conference on Architectural Support for Programming Languages and Operating Systems, Volume 3, La Jolla, 27 April-1 May 2024, 207-222.
https://doi.org/10.1145/3620666.3651329
[13]  Mayr, M., Wind, S., Schroder, L., Moradi, M., Hager, G., Kostler, H. and Wellein, G. (2026) AI Application Benchmarking: Power-Aware Performance Analysis for Vision and Language Models. arXiv: 2603.16164.
https://arxiv.org/abs/2603.16164
[14]  Go, S., Park, J., More, S., Wu, H., Wang, I., Jezghani, A., et al. (2025) Characterizing the Efficiency of Distributed Training: A Power, Performance, and Thermal Perspective. Proceedings of the 58th IEEE/ACM International Symposium on Microarchitecture, Seoul, 18-22 October 2025, 626-642.
https://doi.org/10.1145/3725843.3756111
[15]  Chung, J.W., Ma, J.J., Wu, R., Liu, J., Kweon, O.J., Xia, Y., Wu, Z. and Chowdhury, M. (2025) The ML.ENERGY Benchmark: Toward Automated Inference Energy Measurement and Optimization. arXiv: 2505.06371.
https://arxiv.org/abs/2505.06371
[16]  ?pe?ko, M., Vysocky, O., Jansík, B. and ?íha, L. (2021) DGX-A100 Face to Face Dgx-2—Performance, Power and Thermal Behavior Evaluation. Energies, 14, Article 376.
https://doi.org/10.3390/en14020376
[17]  Elsayed, A.A.E., Al-Obaidi, A.A. and Farag, H.E.Z. (2026) Characterization of High-Resolution AI Data Center Training Workloads on Single and Multiple GPU Nodes. Scientific Data.
https://doi.org/10.1038/s41597-026-07496-6
[18]  Masanet, E., Shehabi, A., Lei, N., Smith, S. and Koomey, J. (2020) Recalibrating Global Data Center Energy-Use Estimates. Science, 367, 984-986.
https://doi.org/10.1126/science.aba3758
[19]  NVIDIA (2026) NVIDIA H100 Tensor Core GPU.
https://www.nvidia.com/en-us/data-center/h100/
[20]  NVIDIA (2026) Product Carbon Footprint Summary for NVIDIA HGX B200.
https://images.nvidia.com/aem-dam/Solutions/documents/HGX-B200-PCF-Summary.pdf
[21]  ASHRAE Technical Committee 9.9. (2024) Liquid Cooling: Resiliency Guidance for Cold Plate Deployments [Technical Bulletin]. ASHRAE.
https://tpc.ashrae.org/Documents?cmtKey=fd4a4ee6-96a3-4f61-8b85-43418dfa988d
[22]  Kuzay, M., Demirel, E., Bayraktar, B., Vilestad, J., K?rnebro, A., Yilmaz, C., et al. (2026) A Self-Assessment Framework for Evaluating Efficiency of Data Centers. Energy Informatics, 9, Article No. 39.
https://doi.org/10.1186/s42162-026-00652-7
[23]  You, J., Chung, J.W. and Chowdhury, M. (2023) Zeus: Understanding and Optimizing GPU Energy Consumption of DNN Training. Proceedings of the 20th USENIX Symposium on Networked Systems Design and Implementation (NSDI’23), Boston, 17-19 April 2023, 119-139.
https://www.usenix.org/conference/nsdi23/presentation/you
[24]  Tschand, A., Rajan, A.T.R., Idgunji, S., Ghosh, A., Holleman, J., Kiraly, C., et al. (2025) MLPerf Power: Benchmarking the Energy Efficiency of Machine Learning Systems from μWatts to MWatts for Sustainable AI. 2025 IEEE International Symposium on High Performance Computer Architecture (HPCA), Las Vegas, 1-5 March 2025, 1201-1216.
https://doi.org/10.1109/hpca61900.2025.00092
[25]  Fadel Argerich, M., Furst, J. and Patino-Martinez, M. (2026) Watt Counts: Energy-Aware Benchmark for Sustainable LLM Inference on Heterogeneous GPU Architectures. arXiv: 2604.09048.
https://arxiv.org/abs/2604.09048
[26]  Hong, S. and Kim, H. (2010) An Integrated GPU Power and Performance Model. Proceedings of the 37th Annual International Symposium on Computer Architecture, Saint-Malo, 19-23 June 2010, 280-289.
https://doi.org/10.1145/1815961.1815998
[27]  Leng, J., Hetherington, T., ElTantawy, A., Gilani, S., Kim, N.S., Aamodt, T.M., et al. (2013) GPUWattch: Enabling Energy Optimizations in GPGPUs. Proceedings of the 40th Annual International Symposium on Computer Architecture, Tel-Aviv, 23-27 June 2013, 487-498.
https://doi.org/10.1145/2485922.2485964
[28]  Kandiah, V., Peverelle, S., Khairy, M., Pan, J., Manjunath, A., Rogers, T.G., et al. (2021) AccelWattch: A Power Modeling Framework for Modern GPUs. MICRO-54: 54th Annual IEEE/ACM International Symposium on Microarchitecture, 18-22 October 2021, 738-753.
https://doi.org/10.1145/3466752.3480063
[29]  NVIDIA (n.d.) Data Center GPU Manager Documentation.
https://docs.nvidia.com/datacenter/dcgm/
[30]  NVIDIA (n.d.) NVIDIA Management Library Documentation.
https://docs.nvidia.com/deploy/nvml-api/
[31]  Yang, Z., Adamek, K. and Armour, W. (2024) Accurate and Convenient Energy Measurements for GPUs: A Detailed Study of NVIDIA GPU’s Built-In Power Sensor. SC24: International Conference for High Performance Computing, Networking, Storage and Analysis, Atlanta, 17-22 November 2024, 1-17.
https://doi.org/10.1109/sc41406.2024.00028
[32]  Garimella, S.V., Fleischer, A.S., Murthy, J.Y., Keshavarzi, A., Prasher, R., Patel, C., et al. (2008) Thermal Challenges in Next-Generation Electronic Systems. IEEE Transactions on Components and Packaging Technologies, 31, 801-815.
https://doi.org/10.1109/tcapt.2008.2001197
[33]  Szekely, V. (1998) Identification of RC Networks by Deconvolution: Chances and Limits. IEEE Transactions on Circuits and Systems I: Fundamental Theory and Applications, 45, 244-258.
https://doi.org/10.1109/81.662698
[34]  Lasance, C.J.M. (2008) Ten Years of Boundary-Condition-Independent Compact Thermal Modeling of Electronic Parts: A Review. Heat Transfer Engineering, 29, 149-168.
https://doi.org/10.1080/01457630701673188
[35]  JEDEC Solid State Technology Association (2010) Transient Dual Interface Test Method for the Measurement of the Thermal Resistance Junction-to-Case of Semi-Conductor Devices with Heat Flow through a Single Path (JESD51-14). JEDEC.
[36]  Farkas, G., Poppe, A. and Rencz, M. (2022) Theoretical Background of Thermal Transient Measurements. In: Rencz, M., Farkas, G. and Poppe, A., Eds., Theory and Practice of Thermal Transient Testing of Electronic Components, Springer, 7-96.
https://doi.org/10.1007/978-3-030-86174-2_2
[37]  Sridhar, A., Vincenzi, A., Ruggiero, M., Brunschwiler, T. and Atienza, D. (2010) 3D-ICE: Fast Compact Transient Thermal Modeling for 3D ICs with Inter-Tier Liquid Cooling. 2010 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 7-11 November 2010, 463-470.
https://doi.org/10.1109/iccad.2010.5653749
[38]  Price, D.C., Clark, M.A., Barsdell, B.R., Babich, R. and Greenhill, L.J. (2015) Optimizing Performance-per-Watt on GPUs in High Performance Computing. Computer Science—Research and Development, 31, 185-193.
https://doi.org/10.1007/s00450-015-0300-5
[39]  Jia, Z., Maggioni, M., Smith, J. and Scarpazza, D.P. (2019) Dissecting the NVIDIA Turing T4 GPU via Microbenchmarking. arXiv: 1903.07486.
https://arxiv.org/abs/1903.07486
[40]  Dean, J. and Barroso, L.A. (2013) The Tail at Scale. Communications of the ACM, 56, 74-80.
https://doi.org/10.1145/2408776.2408794
[41]  Chen, J., Pan, X., Monga, R., Bengio, S. and Jozefowicz, R. (2016) Revisiting Distributed Synchronous SGD. arXiv: 1604.00981.
https://arxiv.org/abs/1604.00981
[42]  Lin, J., Jiang, Z., Song, Z., Zhao, S., Yu, M., Wang, Z., Wang, C., Shi, Z., Shi, X., Jia, W., Liu, Z., Wang, S., Lin, H., Liu, X., Panda, A. and Li, J. (2025) Understanding Stragglers in Large Model Training Using What-If Analysis. Proceedings of the 19th USENIX Symposium on Operating Systems Design and Implementation (OSDI’25), Boston, 7-9 July 2025, 483-498.
https://www.usenix.org/conference/osdi25/presentation/lin-jinkun
[43]  Moore, J., Chase, J., Ranganathan, P. and Sharma, R. (2005) Making Scheduling Cool: Temperature-Aware Workload Placement in Data Centers. Proceedings of the 2005 USENIX Annual Technical Conference, Anaheim, 10-15 April 2005, 61-75.
https://www.usenix.org/conference/2005-usenix-annual-technical-conference/making-scheduling-cool-temperature-aware-workload
[44]  Stojkovic, J., Zhang, C., Goiri, í., Choukse, E., Qiu, H., Fonseca, R., et al. (2025) TAPAS: Thermal-and Power-Aware Scheduling for LLM Inference in Cloud Platforms. Proceedings of the 30th ACM International Conference on Architectural Support for Programming Languages and Operating Systems, Volume 2, Rotterdam, 30 March-3 April 2025 1266-1281.
https://doi.org/10.1145/3676641.3716025
[45]  Lu, R. and Wang, D. (2025) A Thermal-Aware Workload Scheduler for High-Performance LLM Inference in Cooling-Regulated Datacenters. ACM SIGEnergy Energy Informatics Review, 5, 98-104.
https://doi.org/10.1145/3757892.3757906
[46]  Open Compute Project (n.d.) ACS Liquid Cooling Cold Plate Requirements. Open Compute Project.
https://www.opencompute.org/documents/ocp-acs-liquid-cooling-cold-plate-requirements-pdf
[47]  Open Compute Project (n.d.) OAI System Liquid Cooling Guidelines. Open Compute Project.
https://www.opencompute.org/documents/oai-system-liquid-cooling-guidelines-in-ocp-template-mar-3-2023-update-pdf
[48]  ARPA-E (n.d.) COOLERCHIPS Program. U.S. Department of Energy.
https://arpa-e.energy.gov/technologies/programs/coolerchips
[49]  Bhatasana, M. and Marconnet, A.M. (2025) Phase Change Materials as Thermal Buffers for Power Electronics Modules with Transient Heat Loads. Energy Conversion and Management, 343, Article ID: 119931.
https://doi.org/10.1016/j.enconman.2025.119931
[50]  Open Compute Project (n.d.) Cooling Environments. Open Compute Project.
https://www.opencompute.org/wiki/Cooling_Environments

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