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面向声学感知与识别的微纳光纤传感器研究进展
Research Progress on Micro-Nano Fiber Optic Sensors for Acoustic Sensing and Recognition

DOI: 10.12677/app.2026.164031, PP. 335-348

Keywords: 微纳光纤传感器,声学感知,语音识别,信号处理,光子集成
Micro-Nano Fiber Sensor
, Acoustic Sensing, Speech Recognition, Signal Processing, Photonic Integration

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Abstract:

作为人类信息交流最核心的媒介,高精度、高鲁棒性的语音感知技术是推动人机交互与智能医疗发展的关键。传统电声传感器在复杂电磁环境、生物相容性及柔性集成等方面面临固有局限。微纳光纤凭借其亚波长尺度下的强倏逝场效应、高机械柔性及本质抗电磁干扰等独特物理特性,已成为构建高灵敏度声学传感平台的研究热点。本文系统综述了面向声学感知与识别的微纳光纤传感器研究进展。首先阐述了微纳光纤的传感机理及其在微小振动与人体生理信号监测领域的奠基性应用;随后,重点梳理了其在声音信号检测及语音识别领域的探索性成果,并深入探讨了适配光纤信号非线性特征的信号处理算法与机器学习模型,旨在揭示从物理量提取到语义识别的转换逻辑。针对工程化应用,本文进一步分析了不同制备工艺的规模化潜力,以及封装材料对声学响应特性的调制作用。最后,通过与成熟电声系统的多维度对比,客观分析了光纤声学系统在成本、体积及功耗等方面的工程化瓶颈,并提出通过光子集成技术(PIC)实现解调系统小型化、低成本化的未来演进方向,为高性能光纤声学交互系统的开发提供参考。
As the most natural and core medium for human information exchange, high-precision and robust speech perception technology is essential for the advancement of human-machine interaction and intelligent healthcare. Traditional electroacoustic sensors face inherent limitations in complex electromagnetic environments, biocompatibility, and flexible integration. Micro-nano fibers (MNFs), characterized by their strong evanescent field effects at the sub-wavelength scale, high mechanical flexibility, and intrinsic immunity to electromagnetic interference, have emerged as a prominent research focus for constructing highly sensitive acoustic sensing platforms. This paper systematically reviews the research progress of MNF-based sensors for acoustic sensing and recognition. First, the sensing mechanisms and foundational applications of MNFs in tiny vibration and human physiological signal monitoring are elaborated. Subsequently, the exploratory achievements in acoustic signal detection and speech recognition are summarized, with a detailed analysis of signal processing algorithms and machine learning models tailored to the nonlinear characteristics of optical fiber signals, aiming to reveal the transformation logic from physical measurement to semantic recognition. Addressing engineering applications, this paper further analyzes the scaling potential of various fabrication processes and the modulation effects of packaging materials on acoustic response characteristics. Finally, through multi-dimensional comparisons with mature electroacoustic systems, the engineering bottlenecks of fiber-optic acoustic systems in terms of cost, size, and power consumption are objectively analyzed. Future evolutionary directions, such as miniaturizing and cost-reducing demodulation systems via Photonic Integrated Circuits (PIC), are proposed to provide a reference for developing high-performance fiber-optic acoustic interaction systems.

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