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石英压电谐振式力学传感芯片——芯片組裝与推力测试实验
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Abstract:
本实验测试石英力学传感芯片(QCR)在不同组成胶材与金属膜条件下，对于压力与推力测试结果的讨论，压力测试结果与胶材固化条件有高相关性，推力测试结果发现其金属镀膜的存在可提高推力上限值，达到了5.641 kgf，对于整体传感器性能的优化有极大帮助。
This study examines the pressure and thrust response of a quartz mechanical sensing chip (QCR) under varying adhesive formulations and metal coating conditions. The pressure test outcomes are closely tied to the curing parameters of the adhesive material. In thrust testing, the presence of a metal coating was found to increase the maximum thrust capacity to 5.641 kgf, demonstrating a substantial benefit for overall sensor performance enhancement.
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