基于复合系统协同度模型的集成电路产业供应链韧性及安全水平研究
Research on the Resilience and Security Level of Integrated Circuit Industry Supply Chain Based on Composite System Synergy Model

随着全球集成电路产业链的深度整合，其供应链韧性与安全水平已成为影响产业竞争力的关键因素。本文基于供应链通畅性、产业链反映的国际竞争力及价值链体现的创新盈利能力三个层面，运用复合系统协同度模型，对我国集成电路产业链韧性与安全水平进行了系统分析，并构建了反映供应链、产业链及价值链的健康程度的测评指标体系。研究显示：(1) 我国在全球集成电路行业三链建立的系统协同度在2010~2021年期间波动明显，长期趋向融合；(2) 具体来说，价值链有序度较稳定，产业链和价值链需进一步强化协同；(3) 从两链融合情况来看，需要重点提升产业链–价值链协同发展。
With the deep integration of the global IC industry chain, the resilience and security level of its supply chain has become a key factor affecting the competitiveness of the industry. Based on the levels of supply chain fluency, international competitiveness reflected by the industrial chain and innovation profitability embodied by the value chain, this paper applies the composite system synergy model to systematically analyze the resilience and security level of China’s IC industry chain, and constructs a measurement index system reflecting the health of the supply chain, industrial chain and value chain. The study shows that: (1) the degree of system synergy established by China’s three chains in the global IC industry fluctuates significantly during 2010-2021, and tends to converge in the long term; (2) specifically, the degree of order of the value chain is more stable, and the industrial chain and the value chain need to be further strengthened to synergize; and (3) from the point of view of the two-chain convergence, it is necessary to focus on the enhancement of industrial chain-value chain synergistic development.