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Material Sciences 2025
高强韧性氢键协同Diels-Alder键热可逆聚氨酯的自修复性能研究
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Abstract:
本研究通过三步扩链法将聚醚胺D230引入基于Diels-Alder (DA)键的热可逆聚氨酯，制备了一系列含高密度氢键的自修复聚氨酯材料。当nD230:nDA = 1.0:1.5时，高密度氢键和DA键协同作用使得聚氨酯材料具有优异的综合力学性能，其拉伸强度、断裂伸长率和韧性分别达到14.34 MPa、623.65%和68.87 MJ/m3。同时，还赋予聚氨酯材料优异的自修复性能。材料在120℃修复40 min后，再在60℃下保温12 h，其修复效率超过了100%，达到了103.16%。而且，材料还具有优异的多次修复能力，即使经过三次重复修复，其修复效率仍然能够达到66.12%。该研究为开发高性能自修复聚氨酯提供了一种简单且经济的途径，在电子器件、软体机器人等领域有一定的发展前景。
This study introduces polyetheramine D230 into a thermally reversible polyurethane based on Diels-Alder (DA) bonds, resulting in a series of self-healing polyurethane materials containing high-density hydrogen bonds. When the molar ratio nD230:nDA = 1.0:1.5, the synergistic effect of high-density hydrogen bonds and DA bonds endows the polyurethane with outstanding comprehensive mechanical properties, achieving a tensile strength of 14.33 MPa, an elongation at break of 623.65%, and a toughness of 68.87 MJ/m3. Moreover, the synergistic interaction between hydrogen bonding and thermally reversible DA bonds imparts excellent self-healing performance to the material. After treatment at 120？C for 40 minutes followed by maintaining at 60？C for 12 hours, complete self-healing can be achieved. Additionally, the material demonstrates exceptional multi-cycle healing capability, maintaining a healing efficiency of 66.12% even after three damage-healing cycles. This study provides a simple and cost-effective approach for developing high-performance self-healing polyurethane, with promising applications in fields such as electronic devices and soft robotics.
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