An Antimicrobial and Antioxidant Hydrogel Dressing for Wound Repair

The management of chronic wounds remains a substantial challenge for healthcare providers. Inadequate wound care can result in serious complications, including infection, which may ultimately lead to amputation or even death. While traditional excipients exhibit some efficacy in promoting wound healing, they are not sufficiently effective in preventing wound infections. As an antimicrobial metal, copper has a long history in the antimicrobial field, and at the same time, wound auxiliaries with copper ions have also been used in the treatment of chronic wounds. To address the limitations of conventional wound dressings, including insufficient antimicrobial properties and limited capacity to promote wound healing, this study introduces a highly adhesive hydrogel with superior mechanical stability for non-invasive wound treatment. The hydrogel was composed of carboxymethyl chitosan, tannic acid and copper ions. The tannic acid solution was subjected to dropwise addition of CuCl₂ solution to produce precipitation, and tannic acid/copper ions (TA/Cu²⁺) composite nanoparticles were prepared. Through topological adhesion, the CMCS with pH sensitivity has the ability to establish adhesive connections with a wide range of materials. The benefits of CMCS/TA/Cu²⁺ hydrogel, as a kind of wound closure and repair material, include efficient wound closure, and resistance against bacterial invasion while maintaining cleanliness. Additionally, it exhibits excellent tensile and mechanical stability that can facilitate effective closure and repair in dynamic areas like joint wounds. This promising hydrogel adhesive has demonstrated potential as a material for wound closure and restoration.