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不同直径和流量对层叠式微通道散热器热性能的影响研究
Effects of Diameters and Flow Rates on Thermal Performance of Multi-Layered Microchannel Heat Sink

DOI: 10.12677/AEPE.2023.112008, PP. 64-72

Keywords: 层叠式微通道散热器,PCHE,数值模拟
Multi-Layered Microchannel Heat Sink
, PCHE, Numerical Simulation

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Abstract:

本文基于PCHE板提出层叠式微通道散热器,并对其在不同直径和流量下进行了数值模拟分析。结论表明,增大流量可以增强散热器换热性能,当散热器一个分析单元的流量从20 ml/min增至40 ml/min时,热阻可降低约35%,但随着流量的进一步升高热阻的减小率也会逐渐下降。流量保持一定时减小通道直径也可以达到增强换热的效果,但增大流量以及减小通道直径都会引起压降的增加。层叠式微通道散热器各层通道的换热情况不相同,底层流体在入口处附近换热较强,而高层部分的流体在入口处换热很弱。在充分发展段,各层通道流体与壁面换热的Nu数趋于一致。
In this work, a multi-layered microchannel heat sink is proposed based on PCHEs, and the numerical simulation analysis is carried out under different diameters and volume flow rates. Increasing the flow rate can enhance the heat transfer performance of the heat sink. When the flow rate increases from 20 ml/min to 40 ml/min, the thermal resistance can be reduced by 35%, but as the flow rate further increases, the reduction rate of thermal resistance will gradually decrease. And when the volume flow rate remains constant, reducing the channel diameter can also achieve the effect of enhancing heat transfer, but both increasing the flow rate and reducing the channel diameter will increase the pressure drop. The heat transfer conditions of each layer of the multi-layered microchannel heat sink are different. The heat transfer of the bottom fluid is strong near the inlet, while the heat transfer of the fluid in the upper layer is weak at the inlet. In the fully developed region, the Nusselt number of the heat transfer between the fluid and the channel wall in each layer tends to be consistent.

References

[1]  Khattak, Z. and Ali, H.M. (2019) Air Cooled Heat Sink Geometries Subjected to Forced Flow: A Critical Review. Inter-national Journal of Heat and Mass Transfer, 130, 141-161.
https://doi.org/10.1016/j.ijheatmasstransfer.2018.08.048
[2]  张根烜, 杨双根, 关宏山. 新型液冷技术简介[C]//2011年机械电子学学术会议. 2011年机械电子学学术会议论文集, 2011年卷. 西安: 中国电子学会电子机械工程分会, 2011: 324-327.
[3]  Lee, J. and Mudawar, I. (2009) Low-Temperature Two-Phase Microchannel Cooling for High-Heat-Flux Thermal Management of Defense Electronics. IEEE Transactions on Components and Packaging Technologies, 32, 453-465.
https://doi.org/10.1109/TCAPT.2008.2005783
[4]  Lee, J. and Mudawar, I. (2008) Fluid Flow and Heat Transfer Characteristics of Low Temperature Two-Phase Micro- Channel Heat Sinks—Part 1: Experimental Methods and Flow Visualization Results. International Journal of Heat and Mass Transfer, 51, 4315-4326.
https://doi.org/10.1016/j.ijheatmasstransfer.2008.02.012
[5]  Barnes, C.M. and Tuma, P.E. (2010) Practical Con-siderations Relating to Immersion Cooling of Power Electronics in Traction Systems. IEEE Transactions on Power Elec-tronics, 25, 2478-2485.
https://doi.org/10.1109/TPEL.2010.2049864
[6]  Tuckerman, D.B. and Pease, R.F.W. (1981) High-Performance Heat Sinking for VLSI. IEEE Electron Device Letters, 2, 126-129.
https://doi.org/10.1109/EDL.1981.25367
[7]  Vafai, K. and Zhu, L. (1999) Analysis of Two-Layered Mi-cro-Channel Heat Sink Concept in Electronic Cooling. International Journal of Heat and Mass Transfer, 42, 2287-2297.
https://doi.org/10.1016/S0017-9310(98)00017-9
[8]  Wei, X.J. and Joshi, Y. (2003) Optimization Study of Stacked Micro-Channel Heat Sinks for Micro-Electronic Cooling. IEEE Transactions on Components and Packaging Technologies, 26, 55-61.
https://doi.org/10.1109/TCAPT.2003.811473
[9]  Wang, H., Chen, Z. and Gao, J. (2016) Influence of Geometric Parameters on Flow and Heat Transfer Performance of Micro-Channel Heat Sinks. Applied Thermal Engineering, 107, 870-879.
https://doi.org/10.1016/j.applthermaleng.2016.07.039
[10]  Kumar, R., Islam, M. and Hasan, M.M. (2018) Investi-gations on Single-Phase Liquid Flow through Semi-Circular Microchannels. International Journal of Applied Engineer-ing Research, 13, 6870-6880.
[11]  Dai, Z., Zheng, Z., Fletcher, D.F., et al. (2015) Experimental Study of Transient Be-haviour of Laminar Flow in Zigzag Semi-Circular Microchannels. Experimental Thermal and Fluid Science, 68, 644-651.
https://doi.org/10.1016/j.expthermflusci.2015.07.001
[12]  张露. 印刷电路板式换热器的研究现状及应用发展[J]. 山东化工, 2022, 51(3): 66-67+70.
[13]  蔡奇彧, 徐尚龙, 吴益昊. 三维硅基微通道散热器优化设计与数值分析[C]//2014年电子机械与微波结构工艺学术会议. 2014年电子机械与微波结构工艺学术会议论文集, 2014年卷. 呼和浩特: 中国电子学会电子机械工程分会, 中国电子学会微波分会, 2014: 104-108.

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