相变微胶囊及导热相变材料的制备与性能研究
Preparation and Properties of Phase Change Microcapsules and Thermal Conductive Phase Change Materials

由于发热电子元器件表面与散热器之间存在着极细微的凹凸不平的界面缝隙，空气会增加界面热阻，阻碍了热量传导，严重影响了电子元器件的整体散热效果。导热界面材料是最佳的解决方案。本文以聚氨酯为囊壁材料，正十八烷为囊芯，采用原位聚合法制备了相变微胶囊。相变微胶囊的DSC测试表明，相变温度在37℃左右，相变潜热在144 J/g左右，具有较高的相变温度、相变潜热，并将其应用于液体硅橡胶中，制备出导热相变材料, 具有优异的导热、储热、耐电压等特性，可以为电子元器件的整体散热提供解决方案。
Due to the extremely fine uneven interface gap between the surface of heating electronic components and the radiator, air will increase the interface thermal resistance, hinder the heat conduction, and seriously affect the overall heat dissipation effect of electronic components. Thermal conductive interface material is the best solution. Phase change microcapsules were prepared by in-situ polymerization with polyurethane as the wall material and n-octadecane as the core. DSC test of phase change microcapsules shows that the phase change temperature is about 37？C and the latent heat of phase change is about 144 J/g. It has high phase change temperature and latent heat of phase change. It is applied to liquid silicone rubber to prepare thermal conductive phase change materials, which have excellent thermal conductivity, heat storage, voltage resistance and other characteristics, and can provide solutions for the overall heat dissipation of electronic components.