低硬度高导热硅胶材料的制备研究
Research on Preparation of Low Hardness and High Thermal Conductive Silica Gel Material

随着高功率芯片功率密度越来越大，单位体积内发热量越来越高，对导热硅胶材料提出更高的设计要求，如硬度、导热特性。本文对低硬度高导热硅胶材料进行了研究，分析了导热系数、硬度与微米级Al₂O₃、纳米级AlN、端羟基乙烯基硅油填充量之间的关系，并对其变化趋势进行了探讨。给出了低硬度高导热硅胶材料的合理配比，所得导热硅胶的导热系数高达8.06 W/m？K，硬度仅仅30 (shore 00)。
With the increasing power density of high-power chips, the calorific value per unit volume is getting higher and higher, which puts forward higher design requirements for thermal conductive silicone materials, such as hardness and thermal conductivity. The low hardness and high thermal conductivity silica gel material has been studied. The relationship between thermal conductivity, hardness and micron-level Al₂O₃, nano-level AlN, and hydroxyl-terminated vinyl silicone oil filling is analyzed, and its changing trend is discussed. A reasonable ratio of low-hardness and high- thermal-conductivity silica gel materials is given. The thermal conductivity of the obtained thermal-conductivity silica gel is as high as 8.06 W/m？K, and the hardness is only 30 (shore 00).