Silicon-Based Embedded Trenches of Active Antennas for High-Responsivity Omnidirectional Photodetection at Telecommunication Wavelengths

Although the use of plasmonic nanostructures for photodetection below the band gap energy of the semiconductor has been intensively investigated recently, efficiencies of such hot electron-based devices have, unfortunately, remained low because of the inevitable energy loss of the hot electrons as they move and transfer in active antennas based on metallic nanostructures. In this work, we demonstrate the concept of high-refractive-index material-embedded trench-like (ETL) active antennas that could be used to achieve almost 100% absorbance within the ultrashallow region (approximately 10 nm) beneath the metal–semiconductor interface, which is a much smaller distance compared with the hot electrons’ mean free path in the noble metal layer. Taking advantage of these ETL-based active antennas, we obtained photoresponsivities under zero bias at wavelengths of 1310 and 1550 nm of 5854 and 693 nA mW–1, respectively—values higher than most those previously reported for active antenna-based silicon (Si) photodetectors that operate at optical telecommunication wavelengths. Furthermore, the ETL antenna strategy allowed us to preserve an omnidirectional and broadband photoresponse, with a superior degree of detection linearity of R2 = 0.98889 under the light of low power density (down to 11.1 μW cm–2). The photoresponses of the ETL antenna-based device varied by less than 10% upon changing the incident angle from normal incidence to 60°. Because these ETL-based devices provide high responsivity and omnidirectional detection over a broad bandwidth, they show promising potentials for use in hot electron-based optoelectronics for many applications (e.g., Si photonics, energy harvesting, photocatalysis, and sensing devices)