Three-dimensional integration of plasmonics and nanoelectronics

Optoelectronic integrated circuits can leverage the large bandwidth and low interconnect delay of optical communications. Developing a three-dimensional optoelectronic integrated circuit architecture could then provide increased integration density, improved operation speeds and decreased power consumption. However, the integration of photonics and electronics in 3D geometries is difficult due to conflicts in materials and fabrication methods. Plasmonics can help address the incompatibility of photonic and electronic circuits, but methods for the 3D integration of plasmonics and electronics on a single chip are limited. Here, we report a strategy for the three-dimensional integration of plasmonics and electronics using waveguide-fed slot antennas and carbon nanotube networks. Our low-temperature approach, which is compatible with complementary metal–oxide–semiconductor (CMOS) technology, is based on a metal engineering technique in which different metals with typical structures are used as different functional modules. Using this approach, we demonstrate a series of 3D integrated circuits including photovoltaic-type plasmonic unidirectional receivers, wavelength–polarization multiplexers, and receivers integrated with CMOS signal-processing circuits