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Optoelectronics 2020
皮秒激光技术的发展现状及未来趋势
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Abstract:
首先通过长脉冲激光与短脉冲之间比较引出皮秒激光技术,其次对皮秒激光技术的发展历程进行阐述,再次介绍了国内和国外的皮秒激光技术发展现状,从次叙述了基于SESAM被动锁模技术的皮秒激光脉冲形成的物理过程,包括非线性放大阶段、非线性吸收阶段和线性放大阶段,另外,介绍了皮秒激光加工技术的优点和应用,其中皮秒激光加工技术应用包括金属钻孔、划线、切割、表面结构化、表面清洗等等几个方面以及具体实例。最后通过比较纳秒、皮秒和飞秒三种激光技术的优劣势来表达对皮秒激光技术的未来展望。
Firstly, the picosecond laser technology is introduced by comparing the long pulse laser with the short pulse laser. Secondly, the development history of the picosecond laser technology is de-scribed. Thirdly, the development status of the domestic and foreign picosecond laser technology is introduced. Then, the physical process of picosecond laser pulse formation based on SESAM passive mode locking technology is described, including nonlinear amplification stage, nonlinear absorption stage and line. In addition, the advantages and applications of picosecond laser processing technology are introduced. The application of picosecond laser processing technology includes metal drilling, marking, cutting, surface structure, surface cleaning and so on. Finally, by comparing the advantages and disadvantages of nanosecond, picosecond and femtosecond laser technology, the future prospect of picosecond laser technology is expressed.
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