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- 2019
SiO2中空微球改性含硅芳炔树脂及其复合材料的结构与性能
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Abstract:
采用SiO2中空微球对含硅芳炔树脂（PSAC）进行改性，制备了SiO2/PSAC复合材料，以改善PSAC固化后质脆的缺点，提高PSAC基复合材料的力学性能，拓展PSAC在航空航天领域的应用。对SiO2/PSAC复合材料和石英纤维布增强SiO2/PSAC（QF-SiO2/PSAC）复合材料的结构与性能进行了研究，采用SEM分析SiO2/PSAC树脂浇铸体和QF-SiO2/PSAC复合材料断面微观结构，并分析SiO2的增韧机制。采用DMA和TGA分析了SiO2/PSAC复合材料耐热性能和热稳定性，虽然SiO2会导致树脂耐热性能略有下降，但其中空结构使树脂具有优异介电性能。当SiO2的添加量达2wt%时，SiO2/PSAC树脂浇铸体弯曲强度达22.3 MPa，失重5%温度为551℃，1 000℃残留率为86.5%；QF-2SiO2/PSAC复合材料的弯曲强度为298.3 MPa，弯曲模量达31.0 GPa，分别提高了27.5%、59.0%；当SiO2添加量为5wt%时，QF-5SiO2/PSAC复合材料的剪切强度提高了16.0%。 SiO2 hollow microspheres modified Si-containing arylacetylene resin (SiO2/PSAC) casting was prepared to ameliorate the brittleness of cured Si-containing arylacetylene resin and to improve the mechanical properties of the SiO2/PSAC resin casting and to meet the need of the application in the field of aeronautics and astronautics. The structure and properties of the SiO2/PSAC resin casting and quartz fiber reinforced SiO2/PSAC (QF-SiO2/PSAC) composites were investigated. The microstructure of SiO2/PSAC resin castings and QF-SiO2/PSAC composites were observed by SEM, and the toughening mechanism of SiO2 was analyzed. The heat resistance and thermal stability of SiO2/PSAC composites were studied by DMA and TGA. The heat resistance of the resin decreased slightly, but the porous structure made the resin excellent in dielectric properties. Meanwhile, when the content of SiO2 is added to 2wt%, the flexural strength of SiO2/PSAC resin casting is 22.3 MPa. The temperature of decomposition (Td5) is 551℃ and the char yield at 1 000℃ is 86.5%; the flexural strength of QF-2SiO2/PSAC composite is 298.3 MPa, and the modulus reaches 31.0 GPa, which increases by 27.5% and 59.0%, respectively; When the content of SiO2 is 5wt%, the shear strength of QF-5SiO2/PSAC composite increases by 16.0%. 国家自然科学基金（90816021
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