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Effects of Sm2O3 and V2O5 Film Stacking on Switching Behaviors of Resistive Random Access Memories

DOI: https://doi.org/10.3390/cryst9060318

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Abstract:

In this work, the resistive switching characteristics of resistive random access memories (RRAMs) containing Sm 2O 3 and V 2O 5 films were investigated. All the RRAM structures made in this work showed stable resistive switching behavior. The High-Resistance State and Low-Resistance State of Resistive memory (R HRS/R LRS) ratio of the RRAM device containing a V 2O 5/Sm 2O 3 bilayer is one order of magnitude higher than that of the devices containing a single layer of V 2O 5 or Sm 2O 3. We also found that the stacking sequence of the Sm 2O 3 and V 2O 5 films in the bilayer structure can affect the switching features of the RRAM, causing them to exhibit both bipolar resistive switching (BRS) behavior and self-compliance behavior. The current conduction mechanisms of RRAM devices with different film structures were also discussed. View Full-Tex

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