非均匀温度分布对热电制冷芯片热端性能的影响
Influences of Non-uniform Temperature Distribution on the Performance of Hot End of a Thermoelectric Refrigerator Chip

在工程应用中，热电制冷（TEC）芯片由于多种原因可能无法在理想均温工况工作，即出现局部高温的情况。本文通过设定的非均匀温度分布来模拟热端散热不良工况，应用三维有限元分析方法对其工作性能进行数值模拟研究。从不同热端工作温度（th：20~40 ℃）、高温区最高过余温度（θm：5~30 ℃）、高温区面积常数（ω：7/16~12/16）等方面分析了不同工况下TEC芯片的工作性能，结果表明：相对制冷量偏差达到-8.788%，相对功率偏差达到2.608%，相对COP偏差达到-10.9%。
Thermoelectric cooler（TEC）chips do not work in an ideal condition with uniform temperature in engineering applications due to various reasons, which leads to local high-temperature region. A non-uniform temperature distribution was applied to simulate the working condition while a 3D finite element method was used in the numerical analysis of TEC chips in the study. The influences of variations in the working temperature of the hot end（th：20~40 ℃）, maximum temperature difference （θm：5~30 ℃）, and area ratio of hot space （ω：7/16~12/16） on the performance of TEC chips were considered. The results indicate that the relative refrigerating capacity deviation reaches to -8.788%, the relative power deviation reaches to 2.608%, and the relative coefficient of performance (COP) reaches to -10.9%