微盘腔半导体激光器阵列热分析
Thermal Analysis of Micro-Disk Cavity Semiconductor Laser Array

微腔激光器由于其具有几何图形简单、体积小、阈值低、可动态模操作、易与其他电子元件集成等优势被人们广泛研究。对已实现定向输出的微腔激光器，可通过阵列分布方式有效提高其输出功率。本文通过建立微盘腔半导体激光器散热模型，利用ANSYS有限元分析软件进行稳态工作下的模拟仿真。在微盘腔激光器阵列散热模式探究的基础上，通过改变激光器阵列周期，得到了芯片温度变化规律。结果显示，在阵列周期550 μm时半径为100 μm微腔激光器阵列可以达到较为理想的散热效果。
Micro-cavity lasers have been widely studied because of their advantages such as simple geometry, small size, low threshold, dynamic mode operation and easy integration with other electronic components. For micro-disk cavity lasers that have achieved directional output, the output power can be effectively increased by array distribution. This paper uses ANSYS finite element analysis software to simulate the heat dissipation model of micro-cavity semiconductor laser. On the basis of exploring the heat dissipation mode of the micro-cavity laser array, the temperature variation rule of the chip is obtained by changing the cycle of the laser array. The results show that a micro-cavity laser array with a radius of 100 μm can achieve a better heat dissipation effect when the array period is 550 μm.