电子组装结构中激光软钎焊研究最新进展
Research State of Laser Soldering in Electronic Assembly

综合评述激光软钎焊技术在电子工业的研究现状,分析激光工艺参数的优化,及其对钎料/焊点组织和性能的影响。同时分析有限元模拟在激光软钎焊中的应用现状,探讨激光软钎焊机理,以及对焊点可靠性的影响。为激光软钎焊技术的进一步研究和应用提供理论支撑。
This paper systematically reviewed the research state of laser soldering in electronic industry, the processing parameters optimization, and its effect on the microstructures and properties of solders/solder joints. In addition, the application of finite element method to laser soldering was analyzed, and the effect mechanism of laser soldering on the solder joints reliability was synchronously discussed. The present review can provide the theory support for the application and further research of laser soldering