微坑阵列掩膜电解加工试验研究
Experimental Study on Electrochemical Machining of Micro Pits Array Mask

为了解决机械零件表面织构的加工问题，并充分利用电解加工的优势，本文基于COMSOL Multiphisics软件进行了微坑阵列掩膜电解加工过程的仿真分析，开展了电解加工零件表面微织构的工艺试验研究，得到了具有微米级别直径与深度的表面阵列微坑，总结了普通直流加工电压与加工时间、脉冲电流加工频率与占空比、不同掩膜孔直径对微坑加工的工艺规律。试验结果表明：在加工时间12 s，脉冲电压12 V，占空比30%，脉冲频率3 000 Hz，掩膜孔径200 μm的参数下，能得出表面质量最优的微坑。
In order to solve the manufacturing of surface texture on mechanical parts and make full use of the advantages of electrochemical machining, based on the COMSOL multiphisics software, the electrochemical machining of mask micro-dimples array simulation analysis and the electrochemical machining of surface texture on mechanical parts experience study were carried out. The diameter and depth in nano size on the surface micro-dimples array were available and the technological rule of micro-dimples machining with common DC (Direct current) processing voltage and processing time, processing impulse current frequency and duty cycle,different diameter of mask holes were carried out. The results showed that the optimal micro-dimples with surface quality is the processing time of 12 s, pulse voltage of 12 V,duty cycle of 30%,pulse frequency of 3 000 Hz, pore size of mask of 200 μm