基于黏弹性本构模型的热固性树脂基复合材料固化变形数值仿真模型
Numerical simulation for curing deformation of resin matrix thermosetting composite using viscoelastic constitutive model

DOI: 10.13801/j.cnki.fhclxb.20170106.002

Keywords: 热固性树脂基复合材料,黏弹性本构模型,数值模拟,残余应力,固化变形
resin matrix thermosetting composite,viscoelastic constitutive model,numerical simulation,residual stress,curing deformation

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