室温潜伏性中温固化环氧树脂体系的制备与性能
Preparation and properties of latent moderate-temperature curing epoxy resin system

DOI: 10.13801/j.cnki.fhclxb.20161219.001

Keywords: 环氧树脂,改性双氰胺,中温固化,潜伏性固化剂,固化动力学
epoxy resin,modified dicyandiamide,moderate-temperature curing,latent curing agent,curing kinetics

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