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-  2018 

(SiCP/Cu)-铜箔叠层复合材料的制备与组织性能
Preparation, microstructure and properties of (SiCP/Cu)-copper foil laminated composites

DOI: 10.13801/j.cnki.fhclxb.20170825.003

Keywords: 叠层复合材料,SiCP,Cu,界面,抗拉强度,断裂韧性
laminated composites
,SiCP,Cu,interface,tensile strength,fracture toughness

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Abstract:

采用浸涂法和热压烧结法制备了(SiCP/Cu)-铜箔叠层复合材料,研究了SiCP含量对材料组织结构、拉伸性能和断裂韧性的影响。结果表明,制备的(SiCP/Cu)-铜箔叠层复合材料层间厚度均匀,界面结合力良好,增强颗粒SiC能够弥散分布于黏结相中和界面处。随着SiCP体积分数的增加,(SiCP/Cu)-铜箔叠层复合材料的抗拉强度和屈服强度都先增加后降低,当SiCP的体积分数为20vol%(总体积为100)时,其抗拉强度和屈服强度达到最大值,分别为226.5 MPa和113.1 MPa,断裂方式主要为韧性断裂和部分脆性解理断裂。裂纹扩展方向平行于层界面时,材料的断裂韧性随SiCP体积分数的增加略有减小,SiCP体积分数为15%时达到最大值16.96 MPa·m1/2;裂纹扩展方向垂直于层界面时,(SiCP/Cu)-铜箔叠层复合材料的断裂韧性随SiCP体积分数的增加逐渐减小,SiCP体积分数为15%时达到最大值12.51 MPa·m1/2。 The (SiCP/Cu)-copper foil laminated composite materials were fabricated by dip coating and hot pressed sintering. The effects of SiCP content on the microstructure, tensil strength and fracture toughness of the (SiCP/Cu)-copper foil laminated composites were studied. The results show that the layer thickness of the (SiCP/Cu)-copper foil laminated composites is homogeneous, the interface bonding is in good condition, and the reinforced phase SiC disperses in the binding phase and interface. With the addition of SiCP, the tensile strength and yield strength firstly increase, and then decrease. When the volume fraction of SiCP is 20vol% (the total content is 100), the tensile strength and yield strength reach the maximum value of 226.5 MPa and 113.1 MPa, respectively. The fractural surface of the specimen after tensile strength test exhibits a ductile fracture mode in conjunction with some cleavage fracture features. The fracture toughness which the crack grow parallel to the layer interface has a little decrease with the increase of SiCP content, the (SiCP/Cu)-copper foil laminated composites with 15vol% SiCP content has maximum fracture toughness of 16.96 MPa·m1/2. When the crack grow perpendicular to the layer interface, the fracture toughness of the samples is also decreased with the increase of SiCP content, the (SiCP/Cu)-copper foil laminated composites with 15vol% SiCP reaches maximum fracture toughness of 12.51 MPa·m1/2. “十三五”国家重点研发项目(2016YFB0301300);国家自然科学基金重点项目(U1637210);中南大学创新驱动计划项目(51271203)

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