微胶囊铜粉对铜复合浆料性能的影响

为提高铜浆料的导电性，利用微胶囊技术在铜粉表面包覆液体石蜡，增强铜粉的抗氧化性，并添加少量导电性能优异的碳纳米管作为导电增强相，制备碳纳米管-铜复合浆料.利用四探针测试仪、扫描电镜等测试方法研究了液体石蜡含量对包覆铜粉性能的影响以及微胶囊铜粉作为主导电相，碳纳米管作为导电增强相对浆料导电性能的影响.结果表明：液体石蜡包覆含量为4 wt%的微胶囊铜粉具有良好的导电性和抗氧化性，其电导率为44.32%IACS；微胶囊铜粉作为碳纳米管-铜浆料的主导电相，制备浆料膜层电阻率为22.59 mΩ·cm，相比于未包覆的铜粉为主导电相制备的浆料膜层电阻率降低了12.44%；碳纳米管作为导电增强相所制备的浆料相比于纯铜浆料，电阻率降低31.74%.
The copper powders were coated with liquid paraffin by micro capsule technology to enhance the antioxidation of copper powders. A small amount of carbon nanotubes with good conductivity were added as conductive reinforced phase to prepare the composite paste. Influences of paraffin content on the paraffin-coated copper powders were analyzed. Influences of micro capsule copper powders as main conductive phase and carbon nanotubes as conductive reinforced phase were characterized by Four-Point probe, scanning electron microscopy(SEM) and other testing methods. The results show that copper powders coated by 4 wt% paraffin have better conductive property and oxidation resistance. Its conductivity is 44.32 s/cm. The micro capsule copper powders are used as conductive phase to prepare the paste. Its resistivity is 22.59 Ω·cm, which is decreased by 12.44% compared to the copper paste. The resistivity of the paste with carbon nanotubes as conductive reinforced phase is decreased by 31.74% compared to the copper paste.