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Smart Grid 2016
p型SiC欧姆接触的研究进展
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Abstract:
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[16] | 朱会丽, 陈厦平, 吴正云. 用于4H-SiC雪崩光电探测器p型欧姆接触的研究[J]. 量子电子学报, 2007, 24(6): 743-747. |
[17] | Laariedh, F., Lazar, M., Cremillieu, P., Penuelas, J., Leclercq, J.-L. and Planson, D. (2013) The Role of Nickel and Titanium in the Formation of Ohmic Contacts on p-Type 4H-SiC. Semiconductor Science and Technology, 28, Article ID: 045007. http://dx.doi.org/10.1088/0268-1242/28/4/045007 |
[18] | Han, C., Zhang, Y.M., Song, Q.W., Tang, X.Y., Guo, H., Zhang, Y.M., et al. (2015) Interface Annealing Characterization of Ti/Al/Au Ohmic Contacts to p-Type 4H-SiC. Journal of Semiconductors, 36, Article ID: 123006. |
[19] | Johnson, B.J. and Capano, M.A. (2004) Mechanism of Ohmic Behavior of Al/Ti Contacts to p-Type 4H-SiC after Annealing. Journal of Applied Physics, 95, 5616. http://dx.doi.org/10.1063/1.1707215 |
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http://dx.doi.org/10.1016/S0921-5107(00)00597-3 |
[21] | Vang, H., Lazar, M., Brosselard, P., Raynaud, C., Cre-millieu, P., Leclercq, J.-L., et al. (2006) Ni-Al Ohmic Contact to p-Type 4H-SiC. Superlattices and Microstructures, 40, 626-631. http://dx.doi.org/10.1016/j.spmi.2006.08.004 |
[22] | Han, L.C., Shen, H.J., Liu, K.A., Wang, Y.Y., Tang, Y.D., Bai, Y., et al. (2014) Improved Adhesion and Interface Ohmic Contact on n-Type 4H-SiC Substrate by Using Ni/Ti/Ni. Journal of Semiconductors, 35, Article ID: 072003.
http://dx.doi.org/10.1088/1674-4926/35/7/072003 |
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http://dx.doi.org/10.1016/S0038-1101(00)00056-3 |
[24] | Vivona, M., Greco, G., Giannazzo, F., Lo Nigro, R., Rascunà, S., Saggio, M. and Roccaforte, F. (2014) Thermal Stability of the Current Transport Mechanisms in Ni-Based Ohmic Contacts on n- and p-Implanted 4H-SiC. Semiconductor Science and Technology, 29, Article ID: 075018. http://dx.doi.org/10.1088/0268-1242/29/7/075018 |
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