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OALib Journal期刊
ISSN: 2333-9721
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应力对ag颗粒增强sncu基复合钎料蠕变性能的影响
Keywords: 材料科学基础学科,蠕变寿命,复合钎料,应力
Abstract:
？使用搭接面积为1mm2的单搭接钎焊接头,研究了恒定温度下应力对ag颗粒增强sncu基复合钎料钎焊接头蠕变寿命的影响,结果表明:ag颗粒增强sncu基复合钎料的蠕变抗力优于99.3sn0.7cu基体钎料;随着应力的增大,复合钎料及其基体钎料钎焊接头的蠕变寿命均呈下降趋势,且应力对复合钎料钎焊接头蠕变寿命的影响比基体钎料明显.
| [1] | 4l.wan,d.q.yu,m.l.huang,j.zhao,improvementofwettabilityandtensilepropertyinsn-ag-relead-freesolderalloy,materialsletters,56(6),1039(2002)
|
| [2] | 5xiazhidong,shiyaowu,chenzhigang,evaluationonthecharacteristicsoftin-silver-bismuthsolder,journalofmaterialsengineeringandperformance,11(1),107(2002)
|
| [3] | 10h.l.reynolds,s.h.kang,j.w.jr.morris,thecreepbehaviorofin-ageutecticsolderjoints,journalofelectronicmateials,28(1),69(1999)
|
| [4] | 11z.guo,y.h.pao,h.conrad,plasticdeformationkineticsof95.5sn4cu0.5agsolderjoints,journalofelectronicpackaging,117(6),100(1995)
|
| [5] | 12w.b.hampshire,thesearchforlead-freesolders,proceedingofsurfacemountinternationalconference,(sanjose,ca.,1992)p.729
|
| [6] | 13s.k.kang,developmentsinlead-freesoldersandsolderingtechnology,journaloftheminerals,metalsandmaterials,54(6),25(2002)
|
| [7] | 14s.choi,j.g.lee,f.guo,t.r.bieler,k.n.subramanian,j.p.lucas,creeppropertiesofsn-agsolderjointscontainingintermetallicparticles.journalofminerals,metalsandmaterials,53(6),22(2001)
|
| [8] | (闫焉服,史耀武,刘建萍,郭福,夏志东,金属颗粒增强的sncu基无铅复合钎料的研究,2004全国博士生学术论坛材料科学分论坛会议论文集,周其风等编(哈尔滨,哈尔滨工业大学出版社,2004)p.336)
|
| [9] | 17yanyanfu,zhouguofeng,liujianping,shiyaowu,xiazhidong,effectofenhancedparticlescuonspreadingperformanceofsnpbbasedcompositesolder,weldingtechnolgy,32(5),42(2003)
|
| [10] | (闫焉服,周国峰,刘建萍,史耀武,夏志东,增强颗粒cu对锡铅基复合钎料铺展性能的影响,焊接技术,32(5),42(2003))
|
| [11] | 18c.y.liu,jianli,g.j.vandntop,w.j.choi,k.n.tu,wettingreactionofsn-agbasedsoldersystemsoncusubstratesplatedwithauand/orpdlayer,journalofelectronicmaterials,30(5),521(2001)
|
| [12] | 19s.chada,r.a.fournelle,w.laub,d.shangguan,coppersubstratedissolutionineutecticsn-agsolderanditseffectonmicrostructure,journalofelectronicmaterials,29(10),1214(2000)
|
| [13] | 1c.hunt,d.lea.solderabilityoflead-freealloys,proceedingsofapex2000,editedbyf.h.gickler(longbeach,ca.march2000)p.1238-1245
|
| [14] | 2c.m.l.wu,d.q.yu,c.m.t.law,l.wang,thepropertiesofsn-9znlead-freesolderalloysdopedwithtracerareearthelements,journalofelectronicmaterials,31(9),921(2002)
|
| [15] | 3c.m.l.wu,d.q.yu,c.m.t.law,l.wang,microstructureandmechanicalpropertiesofnewlead-freesn-cu-resolderalloys,journalofelectronicmaterials,31(9),928(2002)
|
| [16] | 6ning-chenglee.athoroughlookatlead-freesolderalternatives,circuitsassembly,(4),64(1998)
|
| [17] | 7m.abtew,g.selvaduray,lead-freesoldersinmicroelectronics,materialsscienceandengineering,27,95(2000)
|
| [18] | 8b.huang,n.c.lee.prospectofleadfreealternativesforreflowsoldering,in:1999internationalsymposiumonmicroelectronics,editedbyk.n.tuner(chicago,clinton&towerschicago,1999)p.711-721
|
| [19] | 9k.w.moon,w.j.boettinger,u.r.kattner,f.s.biancaniello,c.a.handwerke,experimentalandthermodynamicassessmentofsn-ag-cusolderalloys.journalofelectronicmaterials.,29(10),1122(2000)
|
| [20] | 15a.z.miric,a.grusd,lead-freealloys,soldering&surfacemounttechnology,10(1),19(1998)
|
| [21] | 16yanyanfu,shiyaowu,liujianping,guofu,xiazhidong,studyonmetalparticlesenhancedsn-0.7cubasedlead-freecompositesolder,in:materialsciencegroupofdoctoralforumofchinahit.2004,editedbyzhouqf(harbin,harbininstituteoftechnologypress,2004)p.363
|
| [22] | 20yanyanfu,studyonparticleenhancedsn-basedcompositesolder,dissertationofbeijinguniversityoftechnology,beijinguniversityoftechnology(2004)
|
| [23] | (闫焉服,颗粒增强锡基复合钎料研究,北京工业大学工学博士学位论文,北京工业大学(2004))
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