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OALib Journal期刊
ISSN: 2333-9721
费用：99美元
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时效对无铅焊料ni-p/cu焊点的影响
Keywords: snpbag,snag焊点,时效,微结构,剪切强度
Abstract:
？研究了150℃等温时效对62sn36pb2ag/ni-p/cu及共晶snag/ni-p/cu表面贴装焊点微结构及剪切强度的影响.结果表明,在钎料与ni-p间的界面存在ni3sn4金属间化合物层,其厚度随时效时间增加,ni-p层的厚度减小;时效后,snpbag、snag焊点的剪切强度下降.对于snag焊点,时效250h后其剪切强度剧烈下降,断裂发生在ni-p/cu界面上,在长时间时效后焊点一侧的ni-p层中p的含量较高可能是ni-p/cu结合强度变差的主要原因.snpbag焊点保持着较高的剪切强度.
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