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OALib Journal期刊
ISSN: 2333-9721
费用：99美元
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用高能球磨法制备的细晶al--50si合金的组织与性能
Keywords: 金属材料,细晶,al--si合金,高能球磨,电子封装
Abstract:
？用高能球磨工艺制备al--50si合金粉末,将粉末经冷压、烧结、热压等工艺制备出al--50si合金块体材料,对球磨粉末和块体样品进行了显微组织观察、eds分析和xrd分析,测定了块体样品的密度、硬度和热扩散系数.结果表明:高能球磨后al--50si合金粉末的硅粒子明显细化,其尺寸分布为1--15？μm;在烧结过程中块体样品的硅粒子长大,其尺寸增大到5--30？μm;al--50si合金块体材料具有较高的密度和硬度,其室温热扩散系数为55mm2？?s-1.
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