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以硅酸钠为前驱物用间隔自组装法制备等级介孔二氧化硅*

Keywords: 无机非金属材料,介孔材料,二氧化硅,间隔自组装,硅酸钠

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Abstract:

?以硅酸钠为前驱物,以三嵌段共聚物(p123)为模板剂,用间隔自组装法(即pcsa法)制备了具有等级孔结构的介孔二氧化硅。结果表明:间隔条件等级孔结构的形成起到了关键作用,在加入量合适和间隔时间条件下间隔法允许在不使用添加剂、复合模板剂及特殊的制备条件下使用较廉价的硅酸钠制备有序的等级介孔二氧化硅。等级介孔二氧化硅的第一级介孔孔径约9nm,第二级大孔径分布较宽,介于20-200nm。而在特定的间隔条件下(ss6-4h-4.5与ss3-4h-7.5),可制备出第一级有序的等级介孔二氧化硅。

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