OALib Journal期刊
ISSN: 2333-9721
费用:99美元
|
|
|
超高压熔渗法制备铜/金刚石复合材料的热导率*
Keywords: 复合材料,热导率,超高压熔渗法,铜/金刚石
Abstract:
?用超高压熔渗法制备了金刚石体积分数为90%的铜/金刚石复合材料,其热导率为662wm-1k-1,比用其它方法制备的这种材料的热导率高。sem、eds和xrd的表征结果表明,这种铜/金刚石复合材料的界面结合良好,金刚石与铜之间有过渡层,部分金刚石相互连通。
References
[1] | (张毓隽,童震松,沈卓身,sps方法制备铜/金刚石复合材料,北京科技大学学报,31(8),1019(2009))
|
[2] | 6d.p.h.hasselman,l.f.johnson,effectivethermalconductivityofcompositeswithinterfacialthermalbarrierresistance,journalofcompositematerials,21,508(1987)
|
[3] | 7e.t.swartz,r.o.pohl,thermalboundaryresistance,reviewofmodernphysics,61,605(1989)
|
[4] | 8j.s.he,h.l.zhang,y.zhang,y.m.zhao,x.t.wang,effectofboronadditiononinterfacemicrostructureandthermalconductivityofcu/diamondcompositesproducedbyhightemperature-highpressuremethod,physicastatussolidia,doi:10.1002/pssa.201330237.
|
[5] | 9t.clyne,p.withers,anintroductiontometalmatrixcomposites,1stedition,(cambridge,cambridgeuniversitypress,1993)
|
[6] | 10k.chu,c.c.jia,h.guo,w.s.li,microstructureandthermalconductivityofcu-b/diamondcomposites,journalofcompositematerials,47,2945(2013)
|
[7] | 1n.q.vo,s.w.chee,d.schwen,x.zhang,p.bellon,r.s.averback,microstructuralstabilityofnanostructuredcualloysduringhigh-temperatureirradiation,scriptamaterialia,63,929(2010)
|
[8] | 2k.yoshida,h.morigami,thermalpropertiesofdiamond/coppercompositematerial,microelectronicsreliability,44,303(2004)
|
[9] | 3k.chu,c.c.jia,h.guo,w.s.li,onthethermalconductivityofcu-zr/diamondcomposites,materialanddesign,45,36(2013)
|
[10] | 4x.y.shen,x.b.he,s.b.ren,h.m.zhang,x.h.qu,effectofmolybdenumasinterfacialelementonthethermalconductivityofdiamond/cucomposites,journalofalloysandcompounds,529,134(2012)
|
[11] | 5zhangyujun,tongzhensong,shenzhuoshen,thecopper/diamondcompositesfabricatedbyspsmethod,journalofuniversityofscienceandtechnologybeijing,31(8),1019(2009)
|
Full-Text
|
|
Contact Us
service@oalib.com QQ:3279437679 
WhatsApp +8615387084133
|
|