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电子学报  2014 

基于电磁辐射信号分析的芯片硬件木马检测

, PP. 341-346

Keywords: 集成电路,硬件木马,电磁分析,投影寻踪,检测

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Abstract:

集成电路芯片在制造过程中可能被嵌入恶意硬件电路,形成硬件木马.提出一种新的利用芯片电磁旁路泄漏信息的硬件木马无损检测方法.对芯片表面进行区域划分,通过随机选优算法生成硬件木马测试向量集;利用基于负熵指标的投影寻踪技术将芯片高维旁路信号投影到低维子空间,在信息损失尽量小的前提下发现原始数据中的分布特征,从而实现芯片旁路信号特征提取与识别.针对示例性高级加密标准(AES-128)木马电路的检测实验表明,该技术可以有效分辨基准芯片与硬件木马测试芯片之间的电磁信号特征差异,实现硬件木马检测.

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