Meyer M A,Herrmann M,Langer E,et al.In situ SEM observation of electromigration phenomena in fully embedded copper interconnect structures[J].Microelectronic Engineering,2002(64):375-382.
JIA Zhen-zhang,JIA Zhong-zhang,ZHAO Xin-meng.Direct high resolution in situ SEM observations of very small fatigue crack growth in the ultra-fine grain aluminium alloy IN 9052[J].Scripta Materialia,2004(50):825-828.
[9]
Andersson H,Persson C.In-situ SEM study of fatigue crack growth behaviour in IN718[J].International Journal of Fatigue,2004(26):211-219.