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含能材料  2015 

石墨对TATB基PBX导热性能的影响

DOI: 10.11943/j.issn.1006-9941.2015.11.016

Keywords: TATB 高聚物粘结炸药(PBX) 石墨 导热性能 包覆方式

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Abstract:

为有效调节TATB基高聚物粘结炸药(PBX)的导热性能, 利用闪光导热仪研究了石墨包覆方式(内包和外包)、温度及石墨含量对TATB基PBX导热系数的影响, 应用Agari模型分析了TATB基PBX的导热机制。结果表明, 添加高导热石墨可改善TATB基PBX的导热性能。常温下, 由内包和外包1%(质量分数)石墨改性的TATB基PBX配方的导热系数分别为0.572 W·(m·K)-1和0.697 W·(m·K)-1, 显示, 外包石墨包覆方式比内包石墨包覆方式更好。与不含石墨的TATB基PBX相比, 内包1%和外包1%石墨的TATB基PBX的导热性能分别提高4.76%和27.66%。随温度升高, TATB基PBX及其石墨改性配方的导热性能逐渐降低。随着石墨含量增加, 外包石墨改性的TATB基PBX的导热性能升高。外包2%(质量分数)石墨可使TATB基PBX的导热系数提高至0.786 W·(m·K)-1。TATB基PBX及由内包石墨改性的配方的导热机制符合串联模型, 而由外包石墨改性的配方的导热机制介于串联模型和并联模型之间

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