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高功率808 nm AlGaAs/GaAs基半导体激光器巴条的热耦合特征

Keywords: 热耦合特征,808 nm AlGaAs/GaAs 激光器把条,红外热像技术,有限元方法

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Abstract:

利用红外热成像技术和有限元方法在实验和理论上研究了高功率808nm半导体激光器巴条热耦合特征, 给出了稳态和瞬态热分析, 呈现了详细的激光器巴条热耦合轮廓.发现器件稳态温升随工作电流呈对数增加, 热耦合也随之增加且主要发生在芯片级.另外, 作者利用热阻并联模型解释了芯片级热时间常数随工作电流减小的现象

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