全部 标题 作者
关键词 摘要

OALib Journal期刊
ISSN: 2333-9721
费用:99美元

查看量下载量

相关文章

更多...

Fe-Ni-P合金电沉积机理

DOI: 10.3969/j.issn.1000-5013.2007.03.014

Keywords: Fe-Ni-P合金, 电沉积, 成核机理, 沉积行为

Full-Text   Cite this paper   Add to My Lib

Abstract:

采用阴极极化技术和循环伏安技术,研究Fe-Ni-P合金的电化学特性.实验结果表明,Fe-Ni-P合金较Fe-Ni合金有较负的沉积电位,随着镀液pH值的增加,Fe-Ni-P合金的阴极沉积反应速度变小.采用恒电位阶跃技术研究Fe-Ni-P合金的电结晶行为,结果表明,在玻碳电极上,该合金的电结晶过程遵循瞬时成核三维生长模式,且随着过电位的增加,电极表面晶核数增多.

References

[1]  FREITAG W O, MTHIAS J S, DIGUILIO G. The electrodeposition of nickel-iron-phosphorus thin films for computer memory use [J]. Journal of the Electrochemical Society, 1964(1):35-39.
[2]  SRIDHARAN K, SHEPPARD K. The electrodeposition of amorphous iron-nickel-phosphorus alloy coating [J]. Transactions of the Institute of Metal Finishing, 1994(4):153-158.
[3]  GAO Cheng-hui, ZHOU Bai-yang. The structure and properties of different composition of Ni-Fe-P deposit [J]. Transactions of Nonferrous Metals Society of China, 1996(3):81-85.
[4]  SCHARIFLKER B, HILLS G. Theoretical and experimental studies of multiple nucleation [J]. Electrochimica Acta, 1983(7):879-889.doi:10.1016/0013-4686(83)85163-9.
[5]  SRIDHARAN K, SHEPPARD K. Electrochemical characterization of Fe-Ni-P alloy electrodeposition [J]. Journal of Applied Electrochemistry, 1997.1198-1206.doi:10.1023/A:1018475718629.
[6]  WANG Sen-ling, WU Hui-huang. The electroless plating Ni-Fe-P alloy and its voltammetric behavior [J]. Electrochemistry, 2003(3):327-335.doi:10.3969/j.issn.1006-3471.2003.03.012.

Full-Text

Contact Us

service@oalib.com

QQ:3279437679

WhatsApp +8615387084133