VANAJA A, RAO RMVGK. Synthesis and characterization of epoxy-novolac/bismaleimide networks[J]. Eur Polym J, 2002, 38:187-193.
[2]
JANSEN B J P, TAMMINGA K Y H, MEIJER E H, et al. Preparation of thermoset rubbery epoxy particles as novel toughening modifiers for glassy epoxy resins[J]. Polymer, 1999, 40(20):5601-5607.
RATNA D, BECKER O, KRISHNAMURTHY R, et al. Nanocomposites based on a combination of epoxy resin, hyperbranched epoxy and a layered silicate[J]. Polymer,2003,44(24):7449-7457.
[7]
HSIUE GING-HO, WEI HSIAO-FEN, SHIAO SING-JEN, et al. Chemical modification of dicyclopentadiene-based epoxy resins to improve compatibility and thermal properties[J]. Polymer Degradation and Stability, 2001, 73:309-318.
[8]
SHAM MANLUNG, KIM JANGKYO. Evolution of residual stresses in modified epoxy resins for electronic packaging applications[J]. Composites:Part A, 2004, 35:537-546.
ANANDA KUMAR S, SANKARA NARAYANAN T S N. Thermal properties of siliconized epoxy interpenetrating coatings[J]. Progress in Organic Coatings, 2002, 45:323-330.
[11]
FENG SHENGYU, CUI MENGZHONG. Study of polysiloxanes containing epoxy groups:I Synthesis and characterization of polysiloxanes containing 3-(2,3-epoxypropoxy)propyl groups[J]. Reactive & Functional Polymers, 2000, 45(2):79-83.
XU Kai, CHEN Ming-cai, ZHANG Kui, et al. Synthesis and characterization of novel epoxy resin bearing naphthyl and limonene moieties, and its cured polymer[J]. Polymer, 2004, 45(4):1133-1140.
