EMEL Y,ISKENDER Y.1,3-bis(-aminopropyl)tetramethyldisiloxane modified epoxy resins:curing and characterization[J].Polymer,1998,39(8-9):1691-1695.
[2]
TSUNG H H,CHUN S W.Modification of epoxy resins with polysiloxane thermoplastic polyurethane for electronic encapsulation[J].Polymer,1996,37(13):2733-2742.
[3]
KUMAR S A,NARAYANAN T S.Thermal properties of siliconized epoxy interpenetrating coatings[J].Progress in Organic Coatings,2002,45(4),:323-330.
[4]
SHICH J Y,HO T H,CHUN S W.Synthesis and modification of trifunctional epoxy resin with amine terminated polydimethyl siloxanes for semiconductor encapsulation application[J].Journal of Polymer Research,1996,3(2):125-131.
[5]
HSIUE G H,WEI H F,SHIAO S J,et al.Chemical modification of dicyclopentadiene-based epoxy resins to improve compatibility and thermal properties[J].Polymer Degradation and Stability,2001,73(2):309-318.
