CHARLES W M.Electrical breakdown of thermal spray alumina ceramic applied to AlSiC baseplates used in power module packaging[D].Virginia:Virginia Polytechnic Institute and State University,1999.
[6]
OUYANG J H,SASAKI S.Tribological characteristics of low-pressure plasma-sprayed Al2O3 coating from room temperature to 800℃[J].Tribology International,2005,38(1):49-57.
[7]
GORDON.Substrate coating and semiconductor processing method of improving uniformity of liquid deposition[P].USA Patent:6,555,276,2003-04-29.
[8]
KITAMURA J,IBE H,MIZUNO H,et al.Erosion properties of plasma sprayed ceramic coatings against process plasma in semiconductor production equipment[A].Thermal Spray 2007:Global Coating Solutions[C].Ohio,USA:ASM International,Materials Park,2007.
[9]
EDDY BASS,ROBERT WRIGHT.Modeling semiconductor factories for equipment and cycle time reduction opportunity[EB/OL].http://www.future-fab.com/content/PDF/ff24_current_ issue.pdf,2008-01.
[10]
刘勇,陈晓银.氧化铝热稳定性的研究进展[J].化学通报,2001,(2):65-70.
[11]
EVANS A G,WILSHAW T R.Quasi-static solid particle damage in brittle solids.Pt.1.observations,analysis and implications[J].Acta Metall,1976,24(10):939-956.
