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材料工程  2011 

直流电化学两步处理精磨硬质合金表面对CVD金刚石涂层的影响

, PP. 89-96

Keywords: 直流电化学两步处理法,金刚石涂层,化学气相沉积,精磨硬质合金

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Abstract:

经开刃、精磨处理而具实际加工能力的钨钴硬质合金刀具在制备CVD金刚石涂层前需进行基体前处理,但常规的化学预处理技术对其规模化应用时,会受到腐蚀效率,工艺重复性的限制。以精磨YG6硬质合金铣刀片为研究对象,采用直流弧光放电等离子体CVD设备、SEM、激光Raman光谱仪、原子吸收光谱仪、表面轮廓仪、洛氏硬度计等,研究了直流电化学两步处理(先直流电化学腐蚀,后酸浸蚀)对精磨硬质合金基体以及对金刚石涂层的影响。结果表明直流电化学两步处理能有效去除精磨硬质合金基体表面的WC"表皮",并降低基体表面Co含量;通过改变直流电化学腐蚀时间,可平衡基体表面粗糙度、基体表面Co浓度去除以及去Co后基体表面硬度的关系,可有效调控CVD金刚石涂层从微米向纳米晶型的转变过程,并具有较好的可控性;结合基体/涂层硬度、薄膜品质及膜基附着力等指标,优化了直流电化学两步处理工艺参数为第一步,在10%NaOH电解液中经直流1A电化学腐蚀5min;第二步,王水再腐蚀90s。

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