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材料工程  2013 

热等静压温度对第三代单晶高温合金DD10组织的影响

DOI: 10.3969/j.issn.1001-4381.2013.06.001

Keywords: DD10,热等静压,温度,显微疏松,共晶,枝晶偏析

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Abstract:

采用OM,SEM以及EPMA等手段对比研究了不同热等静压温度对第三代单晶高温合金DD10组织的影响。结果表明在150MPa压力条件下,1290℃热等静压即可使第三代单晶高温合金DD10中的显微疏松完全闭合;随热等静压温度的升高,共晶体积分数逐渐减少,热等静压温度达到1310℃及以上温度,共晶完全溶于基体。在1340℃/150MPa热等静压后,合金中出现局部初熔。热等静压后DD10单晶高温合金的γ'相立方度提高,不同热等静压温度对γ'相的形貌影响基本相同。热等静压降低了DD10单晶高温合金的枝晶偏析,并且热等静压温度越高,枝晶偏析改善越明显。

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