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材料工程  2013 

航空航天轻质高温结构材料的焊接技术研究进展

DOI: 10.3969/j.issn.1001-4381.2013.10.001, PP. 1-12

Keywords: 金属间化合物,陶瓷基复合材料,焊接,强度,界面

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Abstract:

Ti-Al系金属间化合物、陶瓷和陶瓷基复合材料这两大类轻质高温结构材料在航空、航天领域具有很好的应用前景,本文在分析大量文献的基础上,评述了国内外焊接技术主要研究进展,包括材料的可焊性研究进展、不同焊接方法和不同材料组合焊接接头对应的性能以及焊接技术应用研究进展,指出耐高温焊接材料的研制、两大类轻质高温结构材料与异种材料组合的连接技术以及实际焊接接头的考核应用研究应该是今后本领域的重点研究方向。

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